JPH0582977B2 - - Google Patents

Info

Publication number
JPH0582977B2
JPH0582977B2 JP61075453A JP7545386A JPH0582977B2 JP H0582977 B2 JPH0582977 B2 JP H0582977B2 JP 61075453 A JP61075453 A JP 61075453A JP 7545386 A JP7545386 A JP 7545386A JP H0582977 B2 JPH0582977 B2 JP H0582977B2
Authority
JP
Japan
Prior art keywords
lead
leads
lead member
semiconductor element
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61075453A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62232948A (ja
Inventor
Shigeo Hasegawa
Masaki Baba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Metal Mining Co Ltd
Original Assignee
Sumitomo Metal Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Mining Co Ltd filed Critical Sumitomo Metal Mining Co Ltd
Priority to JP7545386A priority Critical patent/JPS62232948A/ja
Publication of JPS62232948A publication Critical patent/JPS62232948A/ja
Publication of JPH0582977B2 publication Critical patent/JPH0582977B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP7545386A 1986-04-03 1986-04-03 リ−ドフレ−ム Granted JPS62232948A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7545386A JPS62232948A (ja) 1986-04-03 1986-04-03 リ−ドフレ−ム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7545386A JPS62232948A (ja) 1986-04-03 1986-04-03 リ−ドフレ−ム

Publications (2)

Publication Number Publication Date
JPS62232948A JPS62232948A (ja) 1987-10-13
JPH0582977B2 true JPH0582977B2 (en]) 1993-11-24

Family

ID=13576714

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7545386A Granted JPS62232948A (ja) 1986-04-03 1986-04-03 リ−ドフレ−ム

Country Status (1)

Country Link
JP (1) JPS62232948A (en])

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01137661A (ja) * 1987-11-24 1989-05-30 Nec Corp リードフレーム
JPH01238151A (ja) * 1988-03-18 1989-09-22 Nec Corp 半導体装置用リードフレーム
JPH02278757A (ja) * 1989-04-19 1990-11-15 Nec Corp 混成集積回路
JPH0821673B2 (ja) * 1989-08-31 1996-03-04 株式会社三井ハイテック リードフレーム，これを用いた半導体装置およびその製造方法
US5227662A (en) * 1990-05-24 1993-07-13 Nippon Steel Corporation Composite lead frame and semiconductor device using the same
JPH0515448U (ja) * 1991-07-31 1993-02-26 住友金属工業株式会社 セラミツクパツケージ
JP2846181B2 (ja) * 1991-09-09 1999-01-13 日立電線株式会社 複合リードフレームの製造方法
JP2601079B2 (ja) * 1991-10-31 1997-04-16 日立電線株式会社 複合リードフレーム
JPH0878599A (ja) * 1994-09-05 1996-03-22 Goto Seisakusho:Kk 集積回路パッケージ及びその製造方法
JP2009231425A (ja) * 2008-03-21 2009-10-08 Toppan Printing Co Ltd テープ基板貼り合わせ構造体及び半導体装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5090569U (en]) * 1973-12-20 1975-07-31
JPS52154358A (en) * 1976-06-18 1977-12-22 Hitachi Ltd Production of semiconductor device
JPS5310269U (en]) * 1976-07-09 1978-01-27
US4147889A (en) * 1978-02-28 1979-04-03 Amp Incorporated Chip carrier
JPS5521128A (en) * 1978-08-02 1980-02-15 Hitachi Ltd Lead frame used for semiconductor device and its assembling
JPS5895657U (ja) * 1981-12-23 1983-06-29 日本電気株式会社 集積回路用リ−ドフレ−ム
JPS58122763A (ja) * 1982-01-14 1983-07-21 Toshiba Corp 樹脂封止型半導体装置
JPS5998545A (ja) * 1982-11-26 1984-06-06 Hitachi Ltd 半導体装置

Also Published As

Publication number Publication date
JPS62232948A (ja) 1987-10-13

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